super bright oval type led lamps doc. no : qw0905- rev. : date : data sheet luy23531/p1 - pf ligitek electronics co.,ltd. property of ligitek only luy23531/p1-pf 12 - mar. - 2007 a pb lead-free parts
directivity radiation note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. package dimensions ligitek electronics co.,ltd. property of ligitek only part no. luy23531/p1-pf page 1/5 11.5 0.5 1.5max 7.9 25.0min 0.5 typ 5.7 4.7 2.54typ + - 1.0min horizontal axis 28 radiation angle(0.5):h 28 degree / v 62 degree 75% 30 -30 75% 100% 0 25% 50%50% 25% vertical axis 62 0 100% 60
t opr operating temperature -40 ~ +85 note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. typical electrical & optical characteristics (ta=25 ) storage temperature -40 ~ +100 tstg absolute maximum ratings at ta=25 electrostatic discharge( * ) forward current reverse current @5v peak forward current duty 1/10@10khz power dissipation parameter page 2/5 2000 ratings i f esd ir pd i fp symbol ma 50 10 120 90 a v ma mw uy unit ligitek electronics co.,ltd. property of ligitek only static electricity or power surge will damage the led. use of a conductive wrist band or anti-electrosatic glove is recommended when handing these led. all devices, equipment and machinery must be properly grounded. * vertical axis 62 horizontal axis 28 viewing angle 2 1/2 (deg) min. 700 20 min. 1.7 forward voltage @ ma(v) max. 2.6 dominant wave length dnm 595 spectral halfwidth nm 15 typ. luminous intensity @20ma(mcd) 1500 emitted yellow part no luy23531/p1-pf material algainp lens color yellow transparent luy23531/p1-pf part no.
ambient temperature( ) fig.4 relative intensity vs. temperature r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) 500 0 0.5 550600650 ambient temperature( ) fig.5 relative intensity vs. wavelength fig.3 forward voltage vs. temperature f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z @ 2 5 -20 1.0 -40 0.8 20 060 40 1.0 0.9 1.1 1.2 0.5 r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 100 80-40-20 0 020 3.0 2.5 2.0 1.5 1.0 80 60 40100 ligitek electronics co.,ltd. property of ligitek only fig.2 relative intensity vs. forward current forward current(ma) 4.0 fig.1 forward current vs. forward voltage typical electro-optical characteristics curve 100 f o r w a r d c u r r e n t ( m a ) 0.1 1.0 10 1.0 forward voltage(v) 2.03.0 1000 uy chip r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a 2.0 1.5 1.0 0.5 5.0 0 1.010 3.0 2.5 page3/5 1001000 part no. luy23531/p1-pf
page 4/5 ligitek electronics co.,ltd. property of ligitek only 2.wave soldering profile soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time only) distance:2mm min(from solder joint to body) 260 c3sec max 5 /sec max temp( c) 260 150 2 /sec max 0 preheat 100 50 time(sec) 0 25 120 dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to body) note:1.wave solder should not be made more than one time. 2.you can just only select one of the soldering conditions as above. 60 seconds max part no. luy23531/p1-pf
ligitek electronics co.,ltd. property of ligitek only mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 mil-std-883:1008 jis c 7021: b-10 reference standard jis c 7021: b-12 mil-std-202:103b jis c 7021: b-11 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 description test condition 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. test item operating life test high temperature storage test reliability test: 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) the purpose of this test is the resistance of the device under tropical for hours. the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs low temperature storage test high temperature high humidity test thermal shock test the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 1.t.sol=230 5 2.dwell time=5 1sec this test intended to see soldering well performed or not. solderability test mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. 1.t.sol=260 5 2.dwell time= 10 1sec. solder resistance test page5/5 part no. luy23531/p1-pf
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